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Macrotron manufacturing processes and manufacturing systems are designed to meet customers' unique and changing requirements. Certified operators working with state-of-the-art equipment and qualified processes allow us to meet the highest standard of quality, efficiency and flexibility.
Our manufacturing technologies include:
- SMT (Surface Mount Technology)
- BGA (Ball Grid Array)
- CSP (Chip Scale Package)
- Flex Circuits Mechanical Assembly
- X-ray Inspection and Microscope Inspection
- No Clean and Aqueous Water Wash Technologies
- Laser Marking and Cutting (CO2 and YAG lasers)
- Pad Printing
- Ultrasonic Welding
- Application Software Content Loading
- COB (Chip On Board) Assembly, Mold, and Singulation
